A New Test Strategy for Complex Printed Circuit Board Assemblies
نویسنده
چکیده
The trend in Printed Circuit Board Assembly (PCBA) technology is towards higher complexity. Many boards have significantly more components and solder joints today than just a few years ago. More components and more solder joints means more defect opportunities and lower yields. A higher number of components typically means higher cost for each PCBA, resulting in higher WIP cost (work in process) and scrap costs. The higher WIP costs and scrap costs are also because higher complexity typically means lower yields and more difficulty in diagnosing when failures occur. Today’s smaller components are also increasing the challenge to place them correctly on the PCB. Components such as 20 mil and 16 mil QFP’s and 0402 and 0201 chip components are examples in this same category. At the same time, we are loosing the 100% electrical access that we have relied so heavily on for the success of In-Circuit Test (ICT). We are also losing visual access of solder joints, such as the joints under a BGA. The decrease in electrical and visual access makes it more difficult for effective test and inspection techniques.
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